? semiconductor components industries, llc, 2012 november, 2012 ? rev. 0 1 publication order number: nye08 ? 10b6/d NYE08-10B6TG protected triac silicon bidirectional thyristor designed for use in solid state relays, mpu interface, ttl logic and any other light industrial or consumer application. supplied in an inexpensive to ? 92 package which is readily adaptable for use in automatic insertion equipment. features ? one ? piece, injection ? molded package ? blocking voltage to 600 v ? sensitive gate triggering in two trigger modes (quadrants) ? improved noise immunity (dv/dt minimum of 500 v/ sec at 125 c) ? compliant with iec6100 ? 4 ? 5 ? high surge current of 8 a ? these are pb ? free devices maximum ratings (t j = 25 c unless otherwise noted) rating symbol value unit peak repetitive off ? state voltage (note 1) (sine wave, 50 to 60 hz, gate open, t j = 25 to 125 c) v drm, v rrm 600 v on ? state current rms (t c = 80 c) (full sine wave 50 to 60 hz) i t(rms) 0.8 a peak non ? repetitive surge current (one full cycle sine wave, 60 hz, t c = 25 c) i tsm 8.0 a circuit fusing considerations (pulse width = 8.3 ms) i 2 t 0.4 a 2 s peak gate power (t c = 80 c, pulse width 1.0 s) p gm 5.0 w average gate power (t c = 80 c, t = 8.3 ms) p g(av) 0.1 w non ? repetitive line peak voltage (iec6100 ? 4 ? 5) v pp 2.0 kv critical rate of rise of all ? state current (i g = 2 x i gt , t r < 100 s, t j = 125 c) di/dt 100 a/ s operating junction temperature range t j ? 40 to +125 c storage temperature range t stg ? 40 to +150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. v drm and v rrm for all types can be applied on a continuous basis. blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. protected triac 0.8 ampere rms 600 volts http://onsemi.com see detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. ordering information com g out to ? 92 (to ? 226aa) case 029 ? 11 pin assignment 1 2 3 gate com out 1 2 3 1 2 bent lead tape & reel ammo pack straight lead bulk pack 3 123 e08 10b6 yww marking diagram x = 3,7,9 y = year ww = work week = pb ? free package (note: microdot may be in either location)
nye08 ? 10b6tg http://onsemi.com 2 thermal characteristics characteristic symbol max unit thermal resistance, junction ? to ? ambient pcb mounted per figure tbd r ja 156 c/w thermal resistance, junction ? to ? tab measured on out tab adjacent to epoxy r jt 25 c/w maximum device temperature for soldering purposes for 10 secs maximum t l 260 c electrical characteristics (t c = 25 c unless otherwise noted; electricals apply in both directions) characteristic symbol min typ max unit off characteristics peak repetitive blocking current t j = 25 c (v d = rated v drm /v rrm ; gate open) t j = +125 c i drm , i rrm ? ? ? ? 2.0 200 a a on characteristics peak on ? state voltage (i tm = 1.1 a peak; pulse width 2.0 ms, duty cycle 2.0%) v tm ? ? 1.3 v gate tri gger current (dc) (v d = 12 vdc, r l = 30 ) out(+), g( ? ) out( ? ), g( ? ) i gt 0.15 0.15 ? ? 10 10 ma latching current (v d = 12 v, i g = 1.2 x i gt ) out(+), g( ? ) all types out( ? ), g( ? ) all types i l ? ? ? ? 30 30 ma gate trigger voltage (dc) (v d = 12 vdc, r l = 30 ) v gt ? ? 1.0 v gate non ? trigger voltage (v d = 12 v, r l = 30 , t j = 125 c) quadrants 2, 3 v gd 0.15 ? ? v dynamic resistance r d ? ? 300 m holding current (v d = 12 vdc, initiating current = 50 ma, gate open) i h ? ? 25 ma dynamic characteristics rate of change of commutating current (commutating dv/dt = 15 v/ s, gate open, t j = 125 c, f = 250 hz, without snubber) di/dt(c) 0.3 ? ? a/ms critical rate of rise of off ? state voltage (v d = 67% v drm , exponential waveform, gate open, t j = 125 c) dv/dt 500 ? ? v/ s clamping voltage (i cl = 1.0 ma, t p = 1 ms, t j = 125 c) v cl 650 ? ? v
nye08 ? 10b6tg http://onsemi.com 3 + current + voltage v tm i h symbol parameter v drm peak repetitive forward off state voltage i drm peak forward blocking current v rrm peak repetitive reverse off state voltage i rrm peak reverse blocking current voltage current characteristic of triacs (bidirectional device) i drm at v drm on state off state i rrm at v rrm quadrant 1 out+ quadrant 3 out ? v tm i h v tm maximum on state voltage i h holding current com (+) i gt gate (+) out ref com ( ? ) i gt gate (+) out ref com (+) i gt gate ( ? ) out ref com ( ? ) i gt gate ( ? ) out ref ? out negative (negative half cycle) out positive (positive half cycle) + quadrant iii quadrant iv quadrant ii quadrant i quadrant definitions for a triac i gt ? + i gt all polarities are referenced to com.
nye08 ? 10b6tg http://onsemi.com 4 0.001 0.01 0.1 1 10 100 0.3 0.8 1.3 1.8 2.3 2.8 3.3 3.8 figure 1. maximum on ? state voltage characteristics v t , instantaneous on-state voltage (v) i t , instantaneous on ? state current (a) t j = 125 c t j = 25 c t j = ? 40 c 0 5 10 15 20 25 ? 40 ? 25 ? 10 5 20 35 50 65 80 95 110 125 figure 2. typical gate trigger current t j , junction temperature ( c) i gt , gate trigger current (ma) q3 q2 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 ? 40 ? 25 ? 105 203550658095110125 t j , junction temperature ( c) figure 3. typical gate trigger voltage v gt , gate trigger voltage (v) q3 q2 0 10 20 30 40 50 60 ? 40 ? 25 ? 105 203550658095110125 q3 q2 i l , latching current (ma) figure 4. typical latching current t j , junction temperature ( c) 0 5 10 15 20 25 30 35 ? 40 ? 25 ? 10 5 20 35 50 65 80 95 110 125 i h , holding current (ma) figure 5. typical holding current t j , junction temperature ( c) mti1 positive mti1 negative
nye08 ? 10b6tg http://onsemi.com 5 to ? 92 eia radial tape in fan fold box or on reel h2a h2a h f1 f2 p2 p2 p1 p d w w1 l1 w2 h2b h2b t1 t t2 h4 h5 h1 l figure 6. device positioning on tape symbol item specification inches millimeter min max min max d tape feedhole diameter 0.1496 0.1653 3.8 4.2 d2 component lead thickness dimension 0.015 0.020 0.38 0.51 f1, f2 component lead pitch 0.0945 0.110 2.4 2.8 h bottom of component to seating plane 0.059 0.156 1.5 4.0 h1 feedhole location 0.3346 0.3741 8.5 9.5 h2a deflection left or right 0 0.039 0 1.0 h2b deflection front or rear 0 0.051 0 1.0 h4 feedhole to bottom of component 0.7086 0.768 18 19.5 h5 feedhole to seating plane 0.610 0.649 15.5 16.5 l defective unit clipped dimension 0.3346 0.433 8.5 11 l1 lead wire enclosure 0.09842 ? 2.5 ? p feedhole pitch 0.4921 0.5079 12.5 12.9 p1 feedhole center to center lead 0.2342 0.2658 5.95 6.75 p2 first lead spacing dimension 0.1397 0.1556 3.55 3.95 t adhesive tape thickness 0.06 0.08 0.15 0.20 t1 overall taped package thickness ? 0.0567 ? 1.44 t2 carrier strip thickness 0.014 0.027 0.35 0.65 w carrier strip width 0.6889 0.7481 17.5 19 w1 adhesive tape width 0.2165 0.2841 5.5 6.3 w2 adhesive tape position .0059 0.01968 0.15 0.5 2. maximum alignment deviation between leads not to be greater than 0.2 mm. 3. defective components shall be clipped from the carrier tape such that the remaining protrusion (l) does not exceed a maximum of 11 mm. 4. component lead to tape adhesion must meet the pull test requirements. 5. maximum non ? cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. 6. holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. 7. no more than 1 consecutive missing component is permitted. 8. a tape trailer and leader, having at least three feed holes is required before the first and after the last component. 9. splices will not interfere with the sprocket feed holes.
nye08 ? 10b6tg http://onsemi.com 6 ordering & shipping information: packaging options, device suffix device description of to ? 92 tape orientation package shipping u.s. europe equivalent nye08 ? 10b6rl1g flat side of to ? 92 and adhesive tape visible to ? 92 (pb ? free) radial 2000 / tape and reel nye08 ? 10b6tg n/a, bulk to ? 92 (pb ? free) 5000 units / box nye08 ? 10b6rlrpg round side of to ? 92 and adhesive tape visible to ? 92 (pb ? free) radial tape and fan fold box (2000 units / box) nye08 ? 10b6rlrfg round side of to ? 92 and adhesive tape on reverse side to ? 92 (pb ? free) radial tape and fan fold box (2000 units / box)
nye08 ? 10b6tg http://onsemi.com 7 package dimensions to ? 92 (to ? 226aa) case 029 ? 11 issue am notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. contour of package beyond dimension r is uncontrolled. 4. lead dimension is uncontrolled in p and beyond dimension k minimum. r a p j l b k g h section x ? x c v d n n xx seating plane dim min max min max millimeters inches a 0.175 0.205 4.45 5.20 b 0.170 0.210 4.32 5.33 c 0.125 0.165 3.18 4.19 d 0.016 0.021 0.407 0.533 g 0.045 0.055 1.15 1.39 h 0.095 0.105 2.42 2.66 j 0.015 0.020 0.39 0.50 k 0.500 --- 12.70 --- l 0.250 --- 6.35 --- n 0.080 0.105 2.04 2.66 p --- 0.100 --- 2.54 r 0.115 --- 2.93 --- v 0.135 --- 3.43 --- 1 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. contour of package beyond dimension r is uncontrolled. 4. lead dimension is uncontrolled in p and beyond dimension k minimum. r a p j b k g section x ? x c v d n xx seating plane dim min max millimeters a 4.45 5.20 b 4.32 5.33 c 3.18 4.19 d 0.40 0.54 g 2.40 2.80 j 0.39 0.50 k 12.70 --- n 2.04 2.66 p 1.50 4.00 r 2.93 --- v 3.43 --- 1 t straight lead bulk pack bent lead tape & reel ammo pack on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parame ters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 nye08 ? 10b6/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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